Most Magna-Power PCBs retain a thickness of 62 mils, which is the common layer stack-up in industry. For high-current PCBs, each copper layer is 5.6 mils, so when multiple layers are needed, the core thickness is increased to keep the final assembly rigid. On a 4 oz, 4 layer PCB, Magna-Power designs use a 59 mil dielectric core and a total board stack-up of 92 mils. The core thickness will keep the board flat on the pick and place machine, leading to more accurate component placement, and prevents warping caused by heat in the wave or reflow oven. PCB flex caused by general handling, insertion of heavy components (transformers, heatsinks) can cause cracked surface mount resistors and capacitors. Placing components too close to a board edge is a common design mistake that is quickly identified in the production process; applied pressure of a de-paneling saw flexes the PCBs enough to crack delicate MLCC capacitors, and even thick-film resistors, as shown in Fig. 4.
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